锦鲤求职

长鑫存储

封装开发专家-Packaging Development Expert(J17586)

锦鲤会替你打开官网网申、按简历自动填表提交,你只需要在关键步骤确认。

岗位描述

岗位职责
1.Responsible for Dram bumping ,RDL , FO and the other new product development and project management.
2. Analyze and solve technical problems in the development, optimize the process flow and reduce costs.
3.Manage bumping roadmap, RDL roadmap and strategy and execute promotion
4.Improve PKG development efficiency and co-work with package relevant department.
5. Bumping OSAT project management and Process integration
6. Responsible for the assessment and introduction of bumping materials
7. Continue to pay attention to and research advanced bumping and RDL process technology

岗位要求
1. bachelor degree or above
2. More than 8 years of Bumping process development experience , Memory product related experience is preferred . Bumping PIE preferred .
3.proficient in the characteristics of Bumping materials
4.proficient in bumping process
5.proficient in bumping design rule

其他生产制造职位方向的申请准备

先核对岗位要求与自己的经历,再准备档案、投递和面试。

阅读求职步骤与示例 →