岗位描述
岗位职责
1. Lead the RET solution path findings in advanced nodes of DRAM processes;
2. Maintain and develop new recipes to deliver robust post OPC solutions to the apeout team;
3. Engage with layout/device/integration teams on the DFM/DTCO flow delivery;
4. Trouble shooting with inline defects and provide possible RET/OPC supports;
5. Optimize the RET/OPC flow to improve the TAT and efficiency.
岗位要求
1. Master degree in Physical Sciences, Optics, Electrical Engineering, Chemical Engineering, Materials Science, Mathematics etc;
2. 8 years+ experiences of OPC tools and lithography;
3. Strong analytical and problem solving skills;
4. Strong desire and ability to work on new topics to overcome future lithography challenges in the DRAM industry;
5. Ability to work both independently and in a team environment;
6. Fluent English speaking & writing skills;
7. Prefer candidate have background in mask data preparation, physical design, RET, OPC, lithography and other wafer processing steps.