锦鲤求职岗位描述
Job Description:
Create something new
You will industrialize new manufacturing processes for consumer electronics products and transfer them from development into high-volume production. In this role, you actively shape the setup of new supply chains and manufacturing models, including new technology areas such as acoustics or optics.
Assume responsibility
You are responsible for the overall coordination of external assembly suppliers in Asia and act as the primary technical and operational point of contact for all assembly-related topics. You serve as the first escalation point for supplier-related issues (from and towards OSATs) and ensure timely resolution on all levels.
Technical Leadership
You lead and develop the local assembly team by:
Providing technical consultation and guidance on complex packaging and assembly topics
Coaching and supporting team members in problem-solving and technical decision-making
Driving competence development and fostering a high-performance team environment
Acting as a sparring partner for critical technical challenges in mass production and NPI
International Team & Interface Management
You coordinate cross-functional and international teams and act as the key interface between internal stakeholders and external partners. You represent BST Operations towards suppliers and customers in Asia, including:
Leading supplier interactions, audits, and escalation discussions
Acting as local management representative during customer visits
Ensuring alignment between internal requirements and supplier capabilities
Holistic approach (Quality, Cost, Delivery)
Together with suppliers, you drive improvements to achieve quality, cost, and delivery targets in high-volume production. This includes:
Managing supplier-related improvement initiatives and escalations
Challenging interfaces to ensure balanced decision-making (e.g., PCN, RMA topics)
Supporting stability and yield improvement in production
Ensuring structured problem-solving and sustainable corrective actions
Help shape the future
You lead strategic and operational initiatives to optimize complex manufacturing processes in packaging and interconnect technologies. You:
Drive NPI readiness and industrialization
Build and enhance end-to-end manufacturing KPI and analysis systems
Support new manufacturing concepts and long-term operational strategies
Job Qualification:
Personality
Strong communication and leadership skills
Assertive, solution-oriented, and able to influence stakeholders
High level of initiative, ownership, and accountability
Intercultural mindset with willingness to travel
Working style
Structured, analytical, and independent working approach
Strong problem-solving mindset with focus on sustainable solutions
Ability to manage complexity and prioritize effectively in dynamic environments
Experience and Know-how
Several years (>5–7 years) of experience in semiconductor manufacturing, assembly, or development
Deep understanding of assembly and packaging technologies
Strong knowledge of semiconductor manufacturing processes (frontend, wafer test, OSAT, final test)
Experience in supplier management, escalation handling, and high-volume production environments
Familiarity with quality and problem-solving methodologies
Languages
Very good English skills (written and spoken)
German or additional languages are a plus
Education
Master’s, Diploma, or PhD degree in engineering (e.g., electrical engineering, materials science, mechanical engineering, physics, or similar)