锦鲤求职岗位描述
Job Description:
R&D areas _ Power Assembly Interconnection Technology (AIT) for automotive & semiconductor products application
Process development for platform and new product application , ensure industrialization friendly design concept
Risk management during development in automotive & semiconductor products
Support plant for risk assessment and trouble shooting
Innovation of new material and AITs for the next generation of automotive products
Cross-functional team cooperation w/ design, plant, purchasing team in CN-,DE-,HU-,PO-…
Job Qualification:
Education Background: material engineering or mechanical engineering with a master’s degree or higher;
3-5 years experience in development field
Professional Skills:
Familiar with power module production processes, Eg: sintering, soldering, bonding, welding …
Machine evaluation/release experience is preferred;
Problem solving methodology & Cause-effect-relationship (CER) analysis ability
Familiar with automative & industry standards (e.g. IPC, ISO)
Digitalization competence e.g. Python, Power BI & AI is a plus.
Soft Skills:
Team player in cross-functional local & global team
Presentation w/ storytelling
Language:
Fluent in English, German is a plus
Personality:
Self-driven
Customer orientation
Strong ownership
Collaboration & Team work