岗位描述
岗位职责
1、对客户提供的 PCB 设计文件(Gerber、坐标、BOM 等)进行全面的可制造性、可测试性、可组装性分析。
2、识别设计中存在的工艺风险(如元器件布局、焊盘设计、间距、钢网开窗等),并提出具体的改进建议。
3、编制详细的 DFM 报告,并与客户或销售团队进行有效沟通,推动设计优化。
4、基于客户提供的 BOM 清单、Gerber 文件及工艺要求,进行初步的工艺路线评估。
5、协助销售或报价团队,提供 SMT 贴片、DIP 插件、测试等环节的标准工时、材料损耗率等关键数据。
6、接收、校验和管理所有客户提供的技术文件(如原理图、BOM、Gerber、装配图、测试要求等)。
7、将客户提供的 BOM 清单转化为符合公司内部生产标准的格式,包括料号、位号、规格值的统一与标准化,并上传 Agile 系统。
8、将客户提供的相关图纸转化为符合公司内部的文件格式,并上传 Agile 系统。
1、Conduct a comprehensive analysis of manufacturability, testability, and assemblability for PCB design files (Gerber, coordinates, BOM, etc.) provided by customers.
2、Identify process risks in the design (such as component layout, pad design, spacing, stencil opening, etc.) and propose specific improvement suggestions.
3、Prepare detailed DFM (Design for Manufacturability) reports, conduct effective communication with customers or sales teams, and promote design optimization.
4、Conduct a preliminary process route evaluation based on the BOM list, Gerber files, and process requirements provided by customers.
5、Assist the sales or quoting team in providing key data such as standard time and material loss rate for SMT mounting, DIP insertion, testing, and other processes.
6、Receive, verify, and manage all technical documents provided by customers (such as schematics, BOM, Gerber, assembly drawings, test requirements, etc.).
7、Convert the BOM list provided by customers into a format that meets the company's internal production standards, including the unification and standardization of part numbers, reference designators, and specification values, and upload it to the Agile system.
8、Convert the relevant drawings provided by customers into the company's internal file format and upload them to the Agile system.
岗位要求
1、本科及以上学历,电子工程、自动化、通信工程或相关专业。
2、3 年以上 SMT 工程或 NPI 工程师相关工作经验,熟悉 SMT/DIP 整个生产流程。
3、精通 DFM 分析原则,能够独立使用相关软件(如 GC2000、Valor、CAM350 等)进行设计审查。
4、熟练掌握 BOM 整理、数据清洗和格式转化,对电子元器件有深入的了解。
5、具备出色的沟通能力,能够清晰地与客户和内部跨部门团队进行技术交流。
6、工作认真负责,注重细节,具备很强的问题分析和解决能力。
1、Bachelor's degree or above in Electronic Engineering, Automation, Communication Engineering, or related majors.
2、More than 3 years of relevant work experience as an SMT Engineer or NPI (New Product Introduction) Engineer, familiar with the entire SMT/DIP production process.
3、Proficient in DFM (Design for Manufacturability) analysis principles, able to independently use relevant software (such as GC2000, Valor, CAM350, etc.) for design reviews.
4、Skilled in BOM sorting, data cleaning, and format conversion, with in-depth knowledge of electronic components.
5、Possess excellent communication skills, able to conduct clear technical exchanges with customers and internal cross-functional teams.
6、Responsible and detail-oriented in work, with strong problem analysis and solving capabilities.