Process Engineer-Die Bond/Wire Bond

岗位职责
1、负责 TO, COC 以及高速 BOX 等光器件的新项目阶段贴片、焊线以及点胶等关键工艺设计，计划工艺正交实验，验证和定型稳健的工艺，确保能够精益量产高质量、高可靠性的产品
2、负责 COC，高速 100G, 400G 以及 800G 等光器件以及光引擎样品制作；以及对应关键工艺平台评估，验证以及导入
3、支持样品量产阶段的工艺相关问题的分析和解决，提供工艺相关的改善方案
4、负责项目小批量与量产阶段工序能力分析、数据整理及分析
5、新产品阶段主导工艺相关的失效分析，建立工艺失效分析流程指引
6、建立工艺的 SPC 监控机制，负责对工程的量产工程师，技术员进行培训
7、负责样品转量产阶段工作文件编写，以及相关工艺标准工时等降低与优化
1、Be responsible for the key process design such as chip mounting, wire bonding, and dispensing in the new project stage of optical devices like TO, COC, and high-speed BOX. Plan the process orthogonal experiments, verify and finalize the robust process to ensure the lean mass production of high-quality and highly reliable products.
2、Be responsible for the sample production of optical devices such as COC, high-speed 100G, 400G, and 800G, and optical engines; as well as the evaluation, verification, and introduction of the corresponding key process platforms.
3、Support the analysis and solution of process-related problems in the sample mass production stage, and provide process-related improvement plans.
4、Be responsible for the process capability analysis, data collation, and analysis in the small-batch production and mass production stages of the project.
5、Lead the process-related failure analysis in the new product stage and establish the process failure analysis process guidelines.
6、Establish the SPC monitoring mechanism of the process and be responsible for the training of mass production engineers and technicians in the engineering department.
7、Be responsible for the preparation of work documents in the stage of sample transfer to mass production, as well as the reduction and optimization of relevant process standard-hours.

岗位要求
1、光电、电子、材料、机械以及通信等相关专业本科及以上学历
2、3 年以上工作经验，至少 1 年及以上研发工艺开发经验，熟悉光器件开发工艺流程，如贴片、焊线，回流焊，耦合等
3、对共晶 / 固晶贴片以及打线等封装工艺与工艺原理，有较深的理解和经验
4、了解高速光器件封装技术，有半导体元器件贴片（共晶 & 固晶）与焊线（球焊 & 楔焊）等经验，优先考虑有光电子器件封装经验者
5、了解市场主流设备，如 FINETECH, MRSI, ASM，K&S, Kaijo 等；以及熟悉设备基本原理，并具备一定的设备程序编程实操能力、或者工艺优化能力
6、了解贴片吸嘴设计选型，以及瓷嘴的选型与材料选择能力
7、学习能力强，具备一定的分析和解决问题的能力，逻辑思维清晰
8、具有扎实的光电子基础知识，具备一定英文沟通和阅读能力
9、具有良好的团队合作精神，有责任心和耐心，严谨细致，工作积极主动
10、具备一定英语读写与沟通能力
1、A bachelor's degree or above in related majors such as optoelectronics, electronics, materials, machinery, and communication.
2、More than 3 years of work experience, at least 1 year or more of R&D process development experience, familiar with the development process of optical devices, such as chip mounting, wire bonding, reflow soldering, coupling, etc.
3、Have a deeper understanding and experience of packaging processes and process principles such as eutectic/solid crystal chip mounting and wire bonding.
4、Understand the packaging technology of high-speed optical devices, have experience in semiconductor component chip mounting (eutectic & solid crystal) and wire bonding (ball bonding & wedge bonding), etc. Those with experience in optoelectronic device packaging will be given priority.
5、Understand the mainstream equipment in the market, such as FINETECH, MRSI, ASM, K&S, Kaijo, etc.; and be familiar with the basic principles of the equipment, and have certain practical ability in equipment program programming or process optimization ability.
6、Understand the design and selection of chip mounting nozzles, as well as the selection of ceramic nozzles and the ability to select materials.
7、Have strong learning ability, certain analysis and problem-solving abilities, and clear logical thinking.
8、Have a solid basic knowledge of optoelectronics and have certain English communication and reading abilities.
9、Have a good team spirit, be responsible, patient, rigorous, and meticulous, and be proactive in work.
10、Have certain English reading, writing, and communication abilities.