锦鲤求职岗位描述
工作内容
This position provides IC package project management, process& material development and sustaining support for automotive IC bumping&assembly Responsibilities include but not limited to:
1.Understand the bumping&assembly technology, strengths and weaknesses, design rules/spec, process input&output， material properties and participate in driving bumping & assembly improvements
2.Defines overall package performance and specification and realizes technology&material certification through layout design and test vehicle design.
3.Design DOE to resolve assembly issues related materials, process and equipment
4.Working effectively with partner and support groups to ensure effective planning, adherence to schedule, risk assessment, development and delivery of packaging projects.
5.Provides consultation concerning packaging problems and improvements in the packaging process.
6.Building strong relationships with peers, subcons and vendors, working synergistically in a very dynamic environment
The ideal candidate should exhibit the following behavioral traits:
1.Excellent listening, written and verbal communication, tolerance of ambiguity, and commitment to task.
2.Demonstrated skill of working in a high performing team culture which includes setting high expectations, driving performance with a high sense of urgency, role modeling the desired culture, possess excellent teamwork and leadership skills, and demonstrated problem-solving and prioritization skills.
3.Motivated self-starter that has strength in working independently as well as in a team environment.
4.Flexibility and maturity in facing uncertainties and changing priorities.
5.Commit to aggressive goals and win with a can-do attitude.
7.Demonstrate skills in organizational, teamwork, personal, negotiation, problem-solving, leadership, and innovation skills.
任职条件
Qualifications
Minimum Qualifications:
1.Masters (5+ years’ experience) Or Ph.D( 3+ years’ experience) in Mechanical Engineering or Material Science Engineering or Chemical Engineering or Electrical Engineering or Physics or Chemistry or Polymer Science.
2. 3+ years of experience in packaging module development positions
3. 3+ years of experience in packaging TD program management.
4. 3+ years of Experience and good understanding of AEC Q100
Preferred Qualifications:
1. Good understanding or experience of Semiconductor fabrication processes.
2. Demonstrated technical leadership and a track record of problem solving with creativity and out-of-box thinking.