岗位描述
工作内容
In this position, you will be working with a cross-functional team and will be developing package SIPI solutions. Your scope of responsibilities will include, but are not limited to:
• Engaging with silicon designers, package designers to identify&Remove the SIPI risk of IC packaging
• Overseeing all aspect of package SIPI optimization from device concept to production
• Performing simulation of highspeed IO interconnect channels and workload power analysis.
• Creating signal measurement/power test plans and reviewing measurement results
• Correlating measurements to SIPI simulations
• Defining and continuously improve methods/flows for SIPI model generation, leveraging industry best practices and pos-sillicon learning
任职条件
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications:
• Candidate must possess a Master's, or PhD degree in Electrical Engineering, Electronics Engineering, computer science or related field
• 5+ years of experience with complex SOC projects and SIPI correlation
• Signal Integrity experience supporting high-speed signals and memory interfaces such as PCIe, LPDDR, High speed Serdes.
• Fundamental knowledge of transmission line theory and high-speed Printed Circuit Boards (PCB) design.
• Experience with EDA Tools & simulation tools.
Preferred Qualifications:
• Substrate layout process and methodology.
• Lab equipment such as TDR VNA digital oscilloscopes and logic analyzers.