锦鲤求职岗位描述
职位概述：
作为稀薄气体运动方面的 资深仿真工程师，你将加入我们充满活力的仿真技术团队，专注于支持下一代先进半导体设备及工艺的开发与优化工作。你将学习并运用流体仿真、粒子仿真等多学科知识，在资深工程师的指导下，对半导体设备研发中的多种问题，进行研究并提供最优的解决方案。这是一个将理论知识应用于尖端半导体设备领域、快速成长并实现个人价值的绝佳平台。
主要职责：
1. 面向稀薄气体流动、低压气体输运或等离子体中性粒子/离子输运等方向，应用粒子模拟的工具 (DSMC 稀薄气体动力学, PIC-MCC 低温等离子体) 进行仿真研究。具体工作函盖真空腔室的抽气，低温等离子体，及微观工艺的形貌仿真
2. 在已有模型基础上，结合粒子仿真方法与半导体工艺应用需求，开发多物理场耦合模型，提升模型在微观工艺过程中的适用性和预测能力
3. 分析仿真结果，形成报告，并对相关的产品设计，及工艺提供改进优化的指导
4. 与各半导体设备产品开发部门的设计，及工艺工程师进行深入的交流：真正理解他们的问题所在，把我们的仿真发现及优化方案推进到实际中去
1. Apply particle-based simulation tools, including DSMC for rarefied gas dynamics and PIC-MCC for low-temperature plasma, to conduct simulation studies in areas such as rarefied gas flow, low-pressure gas transport, and neutral/ion transport in plasma. Specific applications include vacuum chamber pumping, low-temperature plasma, and feature-scale process profile simulation.
2. Develop multiphysics models based on existing frameworks, integrating particle-based simulation methods with semiconductor process requirements to enhance the applicability and predictive capability of microscopic process simulations.
3. Analyze the simulation results, and document with the useful findings that will guide the optimization of product design and process recipe
4. Work with mechanical/process engineers to understand their issues, and explain the simulation findings and recommendation for improvement
岗位要求：
1.博士学历，应届毕业生。等离子体物理，航空航天，力学，能源动力，机械 等相关理工科专业。具有粒子模拟 (DSMC, PIC-MCC,等) 仿真经历
2. 熟练掌握DSMC基本算法，包括粒子初始化、注入、运动推进、分子碰撞、粒子采样、边界处理及统计平均等核心模块的建模与程序实现
3. 具有良好的C++或Python编程能力，熟悉并行计算或高性能程序优化方法。
4. 具备良好的沟通能力、问题分析能力和团队协作意识
1. PhD (graduation 2027) in plasma physics, aerospace engineering, mechanics, energy and power engineering, mechanical engineering, or related field, with particle based modeling experiences with DSMC, PIC-MCC, etc.
2. Proficient in DSMC methodologies, including particle initialization, injection, transport, collision modeling, boundary treatment, sampling, and statistical analysis.
3. Proficiency in C++ or Python is required; experience with parallel computing and high-performance optimization is preferred.
4. Strong communication skills, problem-solving ability, and teamwork spirit.